一区二区国产高清视频在线

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        1. CN/EN

          產品與市場

          SI10US

          特點

          ● 低CTE,高模量,可有效降低封裝基板的翹曲
          優異的耐濕熱性
          良好的PCB加工性
          無鹵材料

          應用領域

          • eMMC, DRAM
          • AP, PA
          • Dual CM
          • Fingerprint, RF Module


          • 產品性能
          • 產品證書
          • 資料下載
          Items Condition Unit SI10US
          Tg DMA 280
          Td 5% wt. loss
          >400
          CTE (X/Y-axis) Before Tg ppm/℃
          10
          CTE (Z-axis)
          α1/α2 ppm/℃
          25/135
          Dielectric Constant 1) (1GHz) 2.5.5.9 - 4.4
          Dissipation Factor 1) (1GHz)
          2.5.5.9 - 0.007
          Peel Strength1) 1/3 OZ, VLP Cu N/mm
          0.80
          Solder Dipping @288℃ min >30
          Young's modulus 50℃ GPa 26
          Young's modulus
          200 GPa
          23
          Flexural Modulus1) 50℃
          GPa
          32
          Flexural Modulus1)
          200
          GPa
          27
          Water Absorption1)
          A % 0.14
          Water Absorption1) 85℃/85%RH,168Hr %
          0.35
          Flammability
          UL-94 Rating
          V-0
          Thermal Conductivity - W/(m.K) 0.61
          Color - - Black

          Remarks:

          *Specimen thickness: 0.10mm. Test method is according to IPC-TM-650.

          *1): specimen thickness: 0.80mm.

          All the typical value listed above isfor your reference only, please turn to Shengyi Technology Co.,Ltd. fordetailed information, and all rights from this data sheet are reserved byShengyi Technology Co.,Ltd.


          一区二区国产高清视频在线
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