一区二区国产高清视频在线

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        1. CN/EN

          產品與市場

          SI13U

          特點

          Tg≥230℃ (DMA),Td>400℃ (5% loss, TGA)
          High Flexural Modulus/Low X, Y / Z-axis CTE
          Good punching & Drilling ability
          Halogen-free compatible with lead-free processing. RoHS/WEEE compliant.


          應用領域

          Memory Card, SSD,DRAM

          Fingerprint, RFModule, AP

          BOC, COB, WBBGA

          • 產品性能
          • 產品證書
          • 資料下載
          Items Condition Unit SI13U
          Tg DMA 245
          Td 5% wt. loss
          >400
          CTE (X/Y-axis) Before Tg ppm/℃
          13
          CTE (Z-axis)
          α1/α2 ppm/℃
          30/140
          Dielectric Constant * (1GHz) @1GHz - 4.8
          Dissipation Factor * (1GHz)
          @1GHz - 0.013
          Peel Strength * 1/3 OZ, LP Cu N/mm
          0.90
          Solder Dipping @288℃ min >30
          Young's modulus 50℃ GPa 22
          Young's modulus
          200℃ GPa
          13
          Flexural Modulus* 50℃
          GPa
          28
          Flexural Modulus*
          200℃
          GPa
          15
          Water Absorption*
          A % 0.14
          Water Absorption* 85℃/85%RH, 168Hr %
          0.35
          Flammability
          UL-94 Rating
          V-0
          Thermal Conductivity - W/(m.K) 0.58
          Color - - Black

          Remarks:

          Specimen thickness: 0.10mm, besides the items with * is for 0.8mm specimen thickness. Test method is according to IPC-TM-650.

          All the typical value listed above is foryour reference only, please turn to Shengyi Technology Co., Ltd. for detailed information, and all rights from this data sheet are reserved by Shengyi Technology Co., Ltd.

          一区二区国产高清视频在线
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